+86-17821156847
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+86-17821156847
XWONDER provides high-precision SMT assembly for prototype, small-batch, and volume PCBA production. Our YAMAHA and Panasonic SMT placement lines, automatic solder paste printing, reflow soldering, and fine-pitch component assembly capabilities support reliable surface-mount manufacturing for complex electronic products. From engineering prototypes to volume production, we focus on accuracy, consistency, and manufacturability for high-density PCBAs.
Our SMT assembly capabilities cover all critical steps for surface-mount PCBA manufacturing, including automatic board loading, solder paste printing, component placement, reflow soldering, and post-reflow inspection. We handle standard and complex SMT projects, supporting fine-pitch ICs, BGAs, QFNs, CSPs, LGAs, and small passive components.
YAMAHA and Panasonic placement lines for precision assembly of all component types.
Automatic solder paste printing and reflow soldering for consistent joints.
Support for BGA, CSP, QFN, LGA, fine-pitch ICs, and passive components.
Prototype, small-batch, and volume production with engineering oversight.
Placement accuracy, reflow profile control, inspection, and QA support.
XWONDER operates advanced Yamaha and Panasonic SMT placement equipment to support high-density PCBA manufacturing. Our SMT lines provide high placement accuracy, flexible component handling, and support for complex packages including BGA, CSP, QFN, LGA, and fine-pitch components.
| Model | Placement Speed | Placement Accuracy | Component Size Range | Max Component Height | Supported Package Types | Max PCB Dimension |
|---|---|---|---|---|---|---|
| YAMAHA YS24 | 72,000 CPH (0.05s/chip) |
±0.05mm Repeatability ±0.03mm |
01005 (0.4×0.2mm) to 45×45mm | 6.5-15mm |
BGA, CSP, QFN, LGA Supports 0.3mm pitch |
L700×W460mm |
| YAMAHA YS12 | 36,000 CPH (0.1s/chip) |
±0.05mm Repeatability ±0.03mm |
0402 (1.0×0.5mm) to 32mm | Not specified |
BGA, CSP, QFN, LGA Supports 0.3mm pitch |
L510×W460mm |
| YAMAHA 100XG |
20,000 CPH Actual ~12-13k |
Same class | 0201 (0.6×0.3mm) to 31×31mm QFP | 4-6.5mm |
BGA, CSP, QFN, LGA Supports 0.3mm pitch |
L460×W440mm |
| Panasonic CM602 |
100k high-speed head 75k universal head 20k multi-function head |
±40μm(chip) | 0402 (1.0×0.5mm) to 100×90mm | 6.5-25mm |
BGA, CSP, QFN, LGA, PoP Supports 0.3mm pitch |
L510×W460mm |
| Panasonic BM212 | 15,000-19,000 CPH |
±50μm(chip) ±30μm(QFP) |
01005 (0.4×0.2mm) to 55×55mm | Up to 25mm | BGA, CSP, QFN, LGA | L510×W460mm |
| Panasonic NPM-W2 |
77,000 CPH dual-lane 42,000 CPH/head |
±40μm(chip) ±30μm(high precision) |
03015 (0.3×0.15mm) to 120×90mm | 30-40mm |
BGA, CSP, μBGA, QFN, LGA Supports 0.3mm pitch |
L750×W550mm |
High-quality SMT assembly affects solder joint reliability, electrical performance, and long-term stability. For high-density PCBAs, small placement errors, solder paste issues, or thermal profile deviations can lead to functional failures. XWONDER focuses on BOM checking, PCB review, stencil preparation, component confirmation, and manufacturability assessment to reduce assembly risks before production.
Different project stages require different SMT support. During prototype production, flexibility and engineering feedback are important. During small-batch validation, process repeatability and issue tracking become more critical. During volume production, stable quality, inspection data, and production efficiency are essential.
| Project Stage | XWONDER Support |
|---|---|
| Prototype | Quick-turn SMT assembly, early design feedback, basic testing support |
| Small-Batch | Process validation, issue tracking, manufacturability improvement |
| Volume Production | Stable line production, inspection, testing, and traceability |
Our SMT assembly capabilities support PCBA projects used in smart home electronics, temperature control systems, automotive electronics, wireless communication devices, industrial control products, and customized electronic modules.
Send your BOM and Gerber files to XWONDER for engineering review and manufacturing support.
