+86-13482454339
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+86-13482454339
Applications:
• Electric ovens & household ovens
• Pellet grills & heating appliances
• Temperature regulation modules
• Sensor-based thermal control systems
Key Features:
• Heat-resistant PCB materials and component selection
• Stable power circuits for continuous high-temperature operation
• Accurate temperature sensing and closed-loop control
• Optimized thermal layout and copper trace design
Advantages:
• Reliable long-term performance under high heat
• Engineering support for custom temperature-control logic
• Suitable for both consumer and industrial heating equipment
Temperature Control PCBA plays a crucial role in high-heat appliances such as electric ovens, pellet grills, heaters, and temperature-regulated home equipment. These boards integrate precision sensing circuits, power-driving components, and thermal protection features to ensure accurate temperature detection and reliable closed-loop control. High-temperature-resistant materials and optimized copper layouts help maintain long-term stability under continuous heating environments. As heating appliances evolve toward greater energy efficiency, safety, and intelligent operation, the demand for durable, high-performance temperature-control PCBAs continues to grow, supporting consistent thermal management and enhanced appliance reliability.
Specification
|
Layer count |
1-40 layers |
|
Assembly Type |
Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
|
Minimum Component Size |
01005 or 0201 (Imperial) / 0402 or 0603 (Metric) |
|
Maximum Component Size |
2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
|
Component Package Types |
BGA, QFN, QFP, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, etc. |
|
Minimum Pad Pitch |
0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
|
Minimum Trace Width |
0.10 mm (4 mil) |
|
Minimum Trace Spacing |
0.10 mm (4 mil) |
|
Minimum Drill Size |
0.15 mm (6 mil) |
|
Maximum Board Size |
18 in x 24 in (457 mm x 610 mm) |
|
Maximum Board Thickness |
0.062 in (1.6 mm) to 0.125 in (3.2 mm) |
|
Board Material |
FR-4, High-Tg FR-4, Aluminum, High Frequency, Flexible(FPC), Rigid-Flex, Rogers, etc. |
|
Surface Finish |
HASL, Immersion Gold, Gold Finger, OSP, Immersion Silver, etc. |
|
Solder Paste Type |
Leaded or Lead-Free |
|
Assembly Process |
Reflow Soldering, Wave Soldering, Hand Soldering |
|
Inspection Methods |
Automated Optical Inspection (AOI), X-ray, Visual Inspection |
|
Testing Methods |
In-Circuit Test (ICT), Functional Test (FCT), |
|
Design for Manufacturing (DFM) |
DFM Analysis and Feedback |
|
Turnaround Time |
Prototype: 24 hours to 7 days, Production: 10 days to 4 weeks |
|
PCB Assembly Standards |
ISO9001:2015; ISO14001:2015; IATF 16949:2016 |
