+86-13482454339
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+86-13482454339
Applications:
• Smart irrigation systems
• Environmental & climate sensors
• Fertilizer automation equipment
• Livestock monitoring devices
Key Features:
• Low-power consumption
• Wireless communication capability
• Rugged design for outdoor conditions
• Accurate sensing and control
Advantages:
• Enables smart, data-driven agriculture
• High durability in variable environments
Layer count |
1-40 layers |
Assembly Type |
Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size |
01005 or 0201 (Imperial) / 0402 or 0603 (Metric) |
Maximum Component Size |
2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types |
BGA, QFN, QFP, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, etc. |
Minimum Pad Pitch |
0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width |
0.10 mm (4 mil) |
Minimum Trace Spacing |
0.10 mm (4 mil) |
Minimum Drill Size |
0.15 mm (6 mil) |
Maximum Board Size |
18 in x 24 in (457 mm x 610 mm) |
Maximum Board Thickness |
0.062 in (1.6 mm) to 0.125 in (3.2 mm) |
Board Material |
FR-4, High-Tg FR-4, Aluminum, High Frequency, Flexible(FPC), Rigid-Flex, Rogers, etc. |
Surface Finish |
HASL, Immersion Gold, Gold Finger, OSP, Immersion Silver, etc. |
Solder Paste Type |
Leaded or Lead-Free |
Assembly Process |
Reflow Soldering, Wave Soldering, Hand Soldering |
Inspection Methods |
Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods |
In-Circuit Test (ICT), Functional Test (FCT), |
Design for Manufacturing (DFM) |
DFM Analysis and Feedback |
Turnaround Time |
Prototype: 24 hours to 7 days, Production: 10 days to 4 weeks |
PCB Assembly Standards |
ISO9001:2015; ISO14001:2015; IATF 16949:2016 |
